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PPTC Resettable Surface Mount Fuse
  • PPTC Resettable Surface Mount Fuse
  • PPTC Resettable Surface Mount Fuse
Payment Type: T/T, D/P, Western Union, Paypal
Min. Order: 1000
Basic Info

Model No.:  LP-SM

Product Description Model NO.: LP-SM Type: Resettable Fuse Shape: SMD Fusing Device: Pop-up Solid Origin: Shanghai, China Breaking Capacity: Low Usaga: Low Voltage Fusing Speed: F Trademark: songshan HS Code: 85361000 LP-SM
Polymer PTC Re-settable Fuse Series           
Features                                                                 Customized size and electrical characteristic available Surface mount packaging for automated assembly Radial-leaded devices for wave-soldering or manually assembly Fast tripping resettable circuit protection Product Dimensions for Surface-mounted Devices                                                 
Unit: mm
Part number


A B C D E Figures for
Max. Max. Max. Min. Min.  Dimension
LP-SM050 7.98 3.18 5.44 0.50 - Fig.1
LP-SM110 7.98 3.18 5.44 0.50 - Fig.1
LP-SM150C 7.98 5.44 1.25 0.80 0.30 Fig.2
LP-SM200C/24 7.98 5.44 1.50 0.80 0.30 Fig.2
LP-SM300C/16 7.98 5.44 1.50 0.80 0.30 Fig.2
LP-SM400C/16 7.98 5.44 2.00 0.80 0.10 Fig.2

Thermal Derating Chart-IH(A)                                          

Part number
Hold current
-40ºC -20ºC 0ºC 25ºC 40ºC 50ºC 60ºC 70ºC 85ºC
LP-SM050 0.80 0.71 0.59 0.50 0.44 0.38 0.32 0.26 0.19
LP-SM110 1.75 1.54 1.32 1.10 0.96 0.83 0.73 0.61 0.42
LP-SM150 2.40 2.09 1.81 1.50 1.33 1.06 1.01 0.83 0.59
LP-SM200C/24 3.18 2.80 2.45 2.00 1.76 1.45 1.32 1.11 0.79
LP-SM300C/16 4.76 4.21 3.66 3.00 2.61 2.21 2.05 1.69 1.17
LP-SM400C/16 6.35 5.63 4.86 4.00 3.46 2.95 2.72 2.24 1.53
Electrical Characteristics at 25ºC                                      
Part number
IH IT Vmax Imax Max. Time-to-trip Pd typ Rmin R1max Figures for
(A) (A) (V) (A) (A) (S) (W) (Ω) (Ω) Dimension
LP-SM050 0.50 1.00 60 10 2.5 4.0 1.9 0.350 1.400 Fig.1
LP-SM110 1.10 2.20 33 40 8.0 0.5 1.9 0.100 0.480 Fig.1
LP-SM150C 1.50 3.00 33 40 8.0 5.0 2.1 0.060 0.250 Fig.2
LP-SM200C/24 2.00 4.00 24 40 8.0 12.0 2.1 0.045 0.125 Fig.2
LP-SM300C/16 3.00 6.00 16 40 8.0 35.0 1.9 0.015 0.048 Fig.2
LP-SM400C/16 4.00 8.00 16 40 8.0 40.0 1.9 0.012 0.010 Fig.2
IH=Hold current: maximum current at which the device will not trip at 25ºC still air.
IT=Trip current: minimum current at which the device will always trip at 25ºC still air.
Vmax=Maximum voltage device can withstand without damage at rated current.
Imax=Maximum fault current device can withstand without damage at rated voltage.
Ttrip=Maximum time to trip at assigned current.
Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment.
Rmin=Minimum device resistance at 25ºC prior to tripping.
R1max=Maximum device resistance measured after 1 hour post one-time trip.
Part Numbering System                                                       
Product series
Hold Current
other necessary information

Test Procedures And Requirements                                                 
Test Test Conditions Accept/Reject Criteria
Resistance In still air @ 25ºC RminRRmax
Time to Trip Specified current, Vmax, 25ºC Tmaximum Time to Trip
Hold Current 30min, at IH No trip
Trip Cycle Life Vmax, Imax, 100cycles No arcing or burning
Trip Endurance Vmax, 24hours No arcing or burning
Application Requirements                                                            
Soldering recommendation:
* Methods: IR, Vapor phase oven, hot air oven, wave solder, soldering temperature should not exceed GB-T2423 request.
* Devices can be cleaned using standard industry methods and solvents.
If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
The maximum ambient temperature shall not exceed 40ºC. Storage temperatures higher than 40ºC could result in the deformation of packaging materials. The maximum relative humidity recommended for storage is 70%. High humidity with high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present.
PPTC devices are intended for protection against occasional over-current or over-temperature fault conditions, and should not be used when repeated fault conditions are anticipated. Operation beyond maximum ratings or improper use may result in device damage and possible electrical arcing and flame.
The specification is intended to present application, product and technical data to assist the user in selecting PPTC circuit production devices. However, users should independently evaluate and test the suitability of each product. Wayon makes no warranties as to the accuracy or completeness of the information and disclaims any liability resulting from its use. Wayon's only obligations are those in the Wayon Standard Terms and Conditions of Sale and in no case will Wayon be liable for any incidental, indirect, or consequential damages arising from the sale, resale, or misuse of its products. Wayon reserves the right to change or update, without notice, any information contained in this specification.

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